参考文献/References:
[1] 廖圣俊,周立娟,尹凯俐,等. 高导热氮化硅陶瓷基板研究现状[J]. 材料导报,2020,34(21):21105-21114.[2] HAGGERTY J S,LIGHTFOOT A. Opportunities for enhancing the thermal conductivities of SiC and Si3N4 ceramics through improved processing[M]∥Ceramic Engineering and Science Proceedings. Hoboken,NJ,USA:John Wiley & Sons,Inc.,2008:475-487.[3] 张景贤,段于森,江东亮,等. 高导热Si3N4陶瓷基片材料的制备研究[J]. 真空电子技术,2016(5):7-10.[4] LEE H M,LEE E B,KIM D L,et al. Comparative study of oxide and non-oxide additives in high thermal conductive and high strength Si3N4 ceramics[J]. Ceramics International,2016,42(15):17466-17471.[5] 王为得,陈寰贝,李世帅,等. 以YbH2-MgO体系为烧结助剂制备高热导率高强度氮化硅陶瓷[J]. 无机材料学报,2021,36(9):959-966.[6] 赵明亮,陈松,孙峰,等. Si3N4陶瓷材料晶界特征分布研究[J]. 物理学报,2021,70(22):254-265.[7] BELADI H,GHADERI A,ROHRER G S. Five-parameter grain boundary characterisation of randomly textured AZ31 Mg alloy[J]. Philosophical Magazine,2020,100(4):456-466.[8] WANG WG,CAI C H,ROHRER G S,et al. Grain boundary inter-connections in polycrystalline aluminum with random orientation[J]. Materials Characterization,2018,144:411-423.[9] HIROSAKI N, OGATA S, KOCER C, et al. Molecular dynamics calculation of the ideal thermal conductivity of single-crystal α-and β-Si3N4[J]. Physical Review B, 2002, 65(13): 134110.