[1]赵嘉辰,许永超,何嘉锋,等.混合磨料柔性抛光工具加工碳化钨合金性能研究[J].福建理工大学学报,2025,23(04):402-408.[doi:10.3969/j.issn.2097-3853.2025.04.014]
 ZHAO Jiachen,XU Yongchao,HE Jiafeng,et al.Study on performance of tungsten carbide alloy processed by mixed abrasive flexible polishing tools[J].Journal of Fujian University of Technology;,2025,23(04):402-408.[doi:10.3969/j.issn.2097-3853.2025.04.014]
点击复制

混合磨料柔性抛光工具加工碳化钨合金性能研究()
分享到:

《福建理工大学学报》[ISSN:2097-3853/CN:35-1351/Z]

卷:
第23卷
期数:
2025年04期
页码:
402-408
栏目:
出版日期:
2025-08-25

文章信息/Info

Title:
Study on performance of tungsten carbide alloy processed by mixed abrasive flexible polishing tools
作者:
赵嘉辰许永超何嘉锋陈丙三石洋王乾廷
福建理工大学材料科学与工程学院
Author(s):
ZHAO Jiachen XU Yongchao HE Jiafeng CHEN Bingsan SHI Yang WANG Qianting
School of Materials Science and Engineering, Fujian University of Technology
关键词:
钨合金柔性抛光半固结抛光盘表面形貌混合磨料
Keywords:
tungsten alloy flexible polishing semi-fixed polishing discs surface morphology mixed abrasives
分类号:
TH161;TG58
DOI:
10.3969/j.issn.2097-3853.2025.04.014
文献标志码:
A
摘要:
使用SiO2、金刚石、SiO2 / 金刚石混合磨料制备半固结柔性抛光盘对碳化钨合金抛光,用去离子水作为抛光液避免污染。基于抛光盘柔性基体的力学特性,探究了不同种类磨料对碳化钨试样的抛光性能,分析了加工后的表面质量。结果表明:使用wSiO2 / w金刚石= 2 ∶ 3 的混合磨料抛光盘加工后,试样表面粗糙度降至0.007 μm,降低了96%,表面深划痕和凹坑被有效去除,PV 值为0.17 μm,相较于使用单一SiO2、金刚石磨料抛光盘加工后的试样表面,PV 值分别降低了81%、64%。
Abstract:
Semi-solidified flexible polishing discs are prepared for polishing tungsten carbide alloys by using SiO2, diamond, and SiO2/diamond mixed abrasives, and deionized water is used as the polishing solution to avoid contamination. Based on the mechanical properties of the flexible substrate of polishing discs, the polishing performance of tungsten carbide specimens with different kinds of abrasives was investigated, and the surface quality after processing was analyzed. Results show that: after the use of a mixed abrasive disc polishing with w SiO2 /w diamond =2∶3, the surface roughness of the sample is reduced to 0.007 μm, and that is a reduction of 96%, the surface deep scratches and pits are effectively removed, and the PV value is 0.17 μm . Compared with the sample surface after the use of a single SiO2 and diamond abrasive disc polishing, PV values are reduced by 81% and 64%, respectively.

参考文献/References:

[1] DAI Y F,WANG J H,TANG Z W,et al. The sub-nanometer finishing surface evolution of tungsten carbide in shear thickening polishing and the effect of the impurities[J]. Precision Engineering,2024,88:997-1010.[2] KOCICH R. Design and optimization of induction heating for tungsten heavy alloy prior to rotary swaging[J]. International Journal of Refractory Metals and Hard Materials,2020,93:105353.[3] QIN C J,HU Z H,TANG A M,et al. An efficient material removal rate prediction model for cemented carbide inserts chemical mechanical polishing[J]. Wear,2020,452:203293.[4] 李航兵. 钨合金超精密切削及其刀具磨损抑制技术研究[D]. 武汉:华中科技大学,2023.[5] 史晓琳. 钨合金研磨抛光表面形貌形成机理及工艺研究[D]. 大连:大连理工大学,2020.[6] 徐成宇,张万一,张天鸿,等. 固结磨料小工具头修形抛光钛合金叶片试验研究[J]. 中国机械工程,2024,35(9):1606-1612.[7] 林晓婷. 碳化钨材料的电化学辅助机械抛光加工机理及工艺研究[D]. 厦门:厦门大学,2022. [8] 袁巨龙, 毛镁姣, 李敏, 等. 基于响应曲面法的YG8硬质合金刀片化学机械抛光工艺参数优化[J]. 中国机械工程, 2018, 29(19): 2290-2297.[9] XU Y C,LIN C,WANG Q T,et al. A novel polishing process with rigid-flexible composite structure plate for sapphire wafer polishing[J]. The International Journal of Advanced Manufacturing Technology,2022,122(2):659-668.[10] WEN H L,LU J,XU S,et al. Mechanical chemical polishing of large-size singlecrystal diamond substrates with a solgel polishing tool[J]. Journal of Manufacturing Processes,2022,80:210-219.

更新日期/Last Update: 2025-08-25